rayontech.sg

AuSn Matching Lid

Screenshot
AuSn (Product2)
Pre-Applied Solder Composition Au80Sn20, Au78Sn22
Lid Materials 4J29, 4J42, Molybdenum Copper, Ceramics
Lid Surface Plating Ni / Au, Ni / Au / Ni / Au Options Available For Hard Gold/Soft Gold Plating *Plating Can Be Customized According To Customer Requirements.

AuSn solder Matching Lids are widely used in high-reliability applications such as RF modules, MEMS devices, and optoelectronics, where hermetic sealing is critical for performance and durability.

These solutions are essential in industries like aerospace, medical, and telecommunications, ensuring robust packaging that withstands extreme environments and prolonged operational demands.

Features

  1. Six-sided electroplating of the cover: The cover undergoes an electroplating process on all six sides, ensuring excellent corrosion resistance and prolonging its lifespan.

  2. Precise pre-placement of the solder preform: The solder preform is accurately positioned on the cover before welding, ensuring consistent and reliable connections.

  3. Small, oxidation-free, and non-punch-through solder joints: The solder joints are small and free from oxidation or damage, guaranteeing optimal electrical and mechanical performance.

  4. High hermeticity, corrosion resistance, and reliability: The product exhibits exceptional sealing properties, resistance to corrosion, and overall reliability.

  5. In-house production from cover forming to electroplating, solder preform forming, and pre-placement: The entire manufacturing process, from the initial shaping of the cover to the final placement of the solder preform, is carried out within our own facilities, ensuring quality control and customization.

Product List

3 x 3

*3×3 Specs information and picture