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Ceramic Packages

Ceramic Packages(zoom)
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Ceramic packages are integral to various high-performance applications, including RF modules, MEMS devices, and optoelectronics, where their superior thermal stability and hermetic sealing ensure reliability and longevity.

These packages are extensively utilized in industries such as aerospace, automotive, and telecommunications, providing robust solutions that withstand harsh environmental conditions and demanding operational requirements

Product List

Ceramic PGA

PGA packages can be sealed with either a frit-sealed ceramic lid or a solder-sealed metal lid. They are widely used due to their high I/O capacity, superior electrical performance, and efficient thermal dissipation in a compact footprint. 

Pin Grid Arrays

  1. Multi-Layer Ceramic Substrate
  2. Footprint Compatible with Pin Grid Array Packages
  3. Diverse Package Sizes
  4. Gold-Plated Pins Arrayed in a Matrix Pattern
  5. Solder, Glass, or Epoxy Sealing
  6. Cavity-Up or Cavity-Down Configurations

CQFP packages are produced through a dry pressing process. Two rectangular or square ceramic pieces, the lid and base, are pressed, screen-printed with solder glass, and glazed.

CQFP packages are widely used in various electronic applications, including high-performance microprocessors, graphics cards, and network interface cards, due to their high pin count, excellent thermal performance, and robust construction.

Quad Flat Pack

  1. Versatile Pin Configuration: Lead spacing ranges from 0.5mm to 1.27mm, accommodating a wide range of pin counts from 28 to 352.
  2. Enhanced Reliability and Longevity: Ceramic construction ensures high reliability and durability, making CQFP packages suitable for demanding applications.
  3. Superior Thermal Performance: Capable of operating continuously in high-temperature environments up to 1000°C, CQFP packages excel in thermal dissipation.
  4. Exceptional Electrical Performance: Ceramic packages offer excellent electrical properties, minimizing signal interference and ensuring optimal performance.

Ceramic Dual In-line Package (CerDIP) is a popular microelectronic packaging technology valued for its reliability, and ability to accommodate various components

Dual Inline Package

  1. Superior Reliability: Ceramic materials provide excellent thermal conductivity, insulation, and mechanical strength, ensuring long-term stability.
  2. Size Considerations: While CerDIPs offer reliability, they are typically larger than other packaging options, limiting their suitability for miniaturized devices.
  3. Assembly Compatibility: CerDIPs are primarily suited for through-hole assembly, potentially limiting their compatibility with modern SMT assembly processes.
  4. Versatile Applications: CerDIP packages are widely used in various industries, including aerospace, telecommunications, and automotive.

Cerquad packages are built from a single layer of high-purity alumina ceramic and feature a leadframe embedded in a non-vitreous glass. The lead configurations can be flat, J-bend, or gullwing. These packages utilize a ceramic cap instead of a metallized seal ring. Some designs incorporate a ceramic window frame for added structural integrity.

Quad Flat Package

  1. Versatile Lead Configurations: Available in flat, J-bend, and gullwing lead configurations to suit various applications.
  2. Robust Construction: Built with high-purity alumina ceramic, providing excellent thermal and mechanical properties.
  3. Surface Mount Compatibility: Designed for surface mount technology, enabling efficient assembly.
  4. Industry Standard Outlines: Adheres to EIAJ or JEDEC outlines for compatibility with standard assembly processes.
  5. Customizable Lead Plating: Offers options for gold, solder dip, or tin plating to meet specific application requirements.

The Ceramic Leadless Chip Carrier (CLCC or LCC) is a square or rectangular surface-mount package that uses metal pads on its four sides for electrical connections, eliminating the need for traditional leads. LCCs typically have 8 to 100 pads, with a pad pitch of 50 or 40 mils. They are well-suited for surface mount applications and can be either directly soldered to a PCB or used with a socket.

Leadless Chip Package

  1. Compact Footprint: Compatible with CQJB and PLCC packages, minimizing board space.
  2. Versatile Body Sizes: Available in various sizes to accommodate different component requirements.
  3. Robust Sealing: Secured with solder, glass, or epoxy seals for reliable performance.
  4. Leadless Design: Utilizes castellations instead of external leads, enabling efficient heat dissipation and reducing assembly complexity.
  5. Flexible Mounting Options: Suitable for both socket and surface mount applications.
  6. Customizable Plating: Offers gold or solder dip plating options to meet specific application needs.

Ceramic SMD package offers better in its structure, light weight, small size requirement for modern electronic equipment.

SMD Packages

  1. Superior Reliability: Ceramic materials provide excellent thermal conductivity, insulation and mechanical strength, ensuring long term stability
  2. Size Consideration: very suitable for miniaturization and lightweight requirement